JESD22-B117

Testing Protocol

The execution of the shear test involves a precision tool that applies a horizontal force to a single solder ball until the bond fails. Instructions in jesd22-b117 dictate the height at which the tool must strike the ball, as small variations in this distance can greatly alter the measured shear force. The standard also sets requirements for the speed of the shear tool, typically ranging from low-speed characterization to high-speed impact testing.

Accurate alignment of the tool and the substrate is necessary to prevent the introduction of bending moments that would invalidate the results.

Failure Classification

Engineers analyze the surface of the fractured bond to determine if the failure occurred within the solder material or at the interface with the pad. A ductile failure within the solder bulk is generally preferred, whereas a brittle failure at the intermetallic layer may indicate a problem with the plating or the reflow temperature. Adherence to jesd22-b117 provides a framework for categorizing these failure modes, which helps in identifying the root cause of weak interconnects.

This analysis is especially important when transitioning to lead-free alloys, which often exhibit different fracture characteristics than traditional tin-lead solders.

Acceptance Threshold

Companies often establish their own internal thresholds by correlating shear strength with the performance of the components in thermal cycling or drop tests. By following this standardized approach, suppliers can provide customers with defensible data regarding the robustness of their semiconductor packaging. Consistent application of the standard reduces the likelihood of catastrophic field failures caused by detached components in mobile devices or automotive controllers.

By adhering to these protocols, manufacturers maintain compliance with international procurement requirements. This documentation supports the long-term reliability of the global electronics supply chain.