
Kirkendall Void Nucleation Mechanics in Electroplated Microbumps
Electroplated copper microbump voids nucleate when bath additive sulfur impurities catalyze vacancy condensation along the Cu-Cu3Sn boundary during thermal aging.

Electroplated copper microbump voids nucleate when bath additive sulfur impurities catalyze vacancy condensation along the Cu-Cu3Sn boundary during thermal aging.
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