Managing Hydrostatic Stress and Void Formation at Intermetallic Interfaces
Mitigate voiding by controlling pad plating impurities, restricting Cu3Sn thickness below 0.8 micrometers, and optimizing underfill to eliminate triaxial tension.
Mitigate voiding by controlling pad plating impurities, restricting Cu3Sn thickness below 0.8 micrometers, and optimizing underfill to eliminate triaxial tension.
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