Intermetallic Compound Kinetics in Lead Free Solder Reliability Warranties
Excessive intermetallic layer growth and Kirkendall voiding cause brittle solder joint field failures that require precise contractual latent defect rules.
SEM EDX Failure Analysis
Meaning
Integrated laboratory technique that combines high resolution imaging with chemical element identification. Forensic engineers use sem edx failure analysis to investigate the root cause of defects in microelectronics and metal alloys. It allows for the visualization of surface topography and the mapping of the underlying elemental composition.
Microscopic Investigation
The scanning electron microscope provides a depth of field that far exceeds traditional optical tools. In the context of sem edx failure analysis, this allows for the detailed inspection of fracture surfaces and the identification of microscopic cracks. The resulting images reveal the physical nature of the failure at the sub-micron scale.
Elemental Composition
Energy dispersive x-ray spectroscopy identifies the specific atoms present in a sample. When performing sem edx failure analysis, the operator can detect contaminants like chlorine or sulfur that may be causing corrosion on a circuit board. This chemical data is essential for distinguishing between manufacturing errors and environmental damage.
Defect Identification
Mapping the distribution of elements shows where different materials have mixed or segregated. For example, sem edx failure analysis can show if a solder joint failed because of the migration of gold from a plating layer. This evidence provides the technical basis for assigning liability between a component supplier and an assembly house.