
Microstructural Intermetallic Degradation Parameters in Fine Pitch Ball Grid Array Reliability
Fine pitch BGA joint failure stems from interfacial intermetallic growth and Kirkendall voiding, controlled by plating purity and reflow heat work.

Fine pitch BGA joint failure stems from interfacial intermetallic growth and Kirkendall voiding, controlled by plating purity and reflow heat work.
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