
Electroplating Bath Organic Impurity Degradation and Intermetallic Interface Voiding Dynamics
Organic bath impurities codeposit in plated copper, accelerating Kirkendall voiding at intermetallic boundaries during reflow and degrading joint strength.

Organic bath impurities codeposit in plated copper, accelerating Kirkendall voiding at intermetallic boundaries during reflow and degrading joint strength.
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