Meaning
Technical industry specification provides the requirements for handling, packing, shipping and using moisture sensitive surface mount devices. Compliance with j-std-033d prevents the occurrence of internal package damage, such as popcorn cracking, during the high heat of the reflow process. This standard classifies components into levels based on their sensitivity to atmospheric humidity.
Exposure Limit
Floor life defines the maximum time a moisture sensitive device can remain outside a protective environment before it must be processed. Once a component exceeds this limit, it is no longer safe to solder without first undergoing a drying cycle. Operators must track the cumulative exposure time for every open bag of parts.
Baking Protocol
Standardized drying procedures involve heating the components at specific temperatures for a set duration to remove absorbed moisture. The j-std-033d specification provides tables that determine the required baking time based on the component thickness and the level of moisture sensitivity. High temperature baking at 125 degrees Celsius is common for components that have not yet been placed on a board.
Protective Packaging
Moisture barrier bags and desiccant packs are used to maintain a dry environment during shipping and storage. A humidity indicator card must be included inside the bag to provide a visual check of the internal conditions upon arrival at the factory. Proper sealing and handling of these materials are verified during the incoming quality inspection at the assembly plant.
