Meaning
Destructive analysis methodology uses a concentrated stream of charged particles to remove material from specific micro areas for depth observation. Laboratories generate a focused ion beam cross section to inspect the quality of hidden layer connections and barrier coatings. Heavy ions provide the physical mass needed to mill through metal and silicon.
Material Removal
Sputtering away surface atoms allows for the creation of precise vertical walls that reveal internal stacks. In a focused ion beam cross section, secondary electron detectors provide clear views of the newly exposed interior. High resolution targets features in the nanometer range.
Structural Mapping
Visualization of logic junctions allows engineers to verify that dimensions match the intended layout rules. Because focused ion beam cross section provides high contrast between copper and oxide, it is ideal for void detection in vias. Defects found here reveal errors in the chemical vapor deposition stage.
Inspection Utility
Utilization of this technique in failure analysis centers in high technology hubs provides physical proof of manufacturing flaws. Once identified, focused ion beam cross section samples are often moved to transmission electron microscopes for atomic level study. The speed of the milling process allows for multiple daily inspections of failing parts.
Accurate calibration of the ion current prevents thermal damage to the sample surface during the dig.
